次世代電子回路基板用ビアフィリング硫酸銅めっき技術(特集次世代電子回路基板 ; 材料・プロセス技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 13(5) (通号 88) 2010.8

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Material Type: 記事
Title: 次世代電子回路基板用ビアフィリング硫酸銅めっき技術
Author/Editor: 西城信吾
Series Title: 特集次世代電子回路基板 ; 材料・プロセス技術
Author Heading: 西城信吾
Alternative Title: Via filling technology with acid copper plating for next generation electronic circuit board
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 13(5) (通号 88) 2010.8
Volume: 13
Issue: 5
Sequential issue number: 88
Pages: 379～382
Publication date of volume/issue (W3CDTF): 2010-08
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10801939
http://id.ndl.go.jp/bib/10801939
Bibliographic Record Category (NDL): 632