マイクロサイズSn-Ag-Cuはんだ接合部の低サイクル疲労破壊特性

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Material Type: 記事
Title: マイクロサイズSn-Ag-Cuはんだ接合部の低サイクル疲労破壊特性
Author/Editor: 田代直樹
神田喜彦
苅谷義治
Author Heading: 田代直樹
神田喜彦
苅谷義治
Alternative Title: Fatigue fracture properties of micro size Sn-Ag-Cu solder joint
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 20 2010.9.9・10
Volume: 20
Pages: 59～62
Publication date of volume/issue (W3CDTF): 2010-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10866420
http://id.ndl.go.jp/bib/10866420
Bibliographic Record Category (NDL): 632