ビアフィリングの銅めっき成長機構

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Material Type: 記事
Title: ビアフィリングの銅めっき成長機構
Author/Editor: 和久田陽平
杉本将治
渡辺充広他
Author Heading: 和久田陽平
杉本将治
渡辺充広
Alternative Title: Copper plating growth mechanism of via-filling
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 20 2010.9.9・10
Volume: 20
Pages: 147～150
Publication date of volume/issue (W3CDTF): 2010-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10866667
http://id.ndl.go.jp/bib/10866667
Bibliographic Record Category (NDL): 632