Effect of electron flow direction and via number on electromigration mechanism for copper dual damascene interconnects
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- Material Type
- 記事
- Author/Editor
- Yi-Lung ChengMing-Kai ShiauWei-Yuan Chung 他
- Author Heading
- Periodical title
- Japanese journal of applied physics : JJAP
- No. or year of volume/issue
- 49(12) 2010.12
- Volume
- 49
- Issue
- 12
- Pages
- 124201-1～4
- Publication date of volume/issue (W3CDTF)
- 2010-12