MFP搭載0.13μmCu配線デバイスの故障解析
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- Material Type
- 記事
- Author/Editor
- 横山 弘一直永 卓也西垣 直彦
- Alternative Title
- Failure analysis on a 0.13μm Cu metallization device for multi functional printer
- Periodical title
- Ricoh technical report
- No. or year of volume/issue
- (36) 2010
- Issue
- 36
- Pages
- 85～91
- Publication date of volume/issue (W3CDTF)
- 2010