IEEE1149.1準拠IC間断線の電気検査法(特集次世代基板実装を支える検査技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 14(2) (通号 92) 2011.3

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Material Type: 記事
Title: IEEE1149.1準拠IC間断線の電気検査法
Author/Editor: 橋爪正樹
加藤健二
四柳浩之
Series Title: 特集次世代基板実装を支える検査技術
Author Heading: 橋爪正樹
加藤健二
四柳浩之
Alternative Title: Electrical testing of open defects between IEEE1149.1 compliant ICs
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 14(2) (通号 92) 2011.3
Volume: 14
Issue: 2
Sequential issue number: 92
Pages: 99～102
Publication date of volume/issue (W3CDTF): 2011-03
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 11031141
http://id.ndl.go.jp/bib/11031141
Bibliographic Record Category (NDL): 632