薄型半導体パッケージ...

薄型半導体パッケージ用低熱膨張基板材料 (特集 電子材料技術)

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薄型半導体パッケージ用低熱膨張基板材料(特集 電子材料技術)

Call No. (NDL)
Z16-727
Bibliographic ID of National Diet Library
11059035
Material type
記事
Author
高橋 龍史ほか
Publisher
門真 : パナソニック電工R&D企画室
Publication date
2011-03
Material Format
Digital
Journal name
パナソニック電工技報 59(1) 2011.3
Publication Page
p.25~29
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Digital

Material Type
記事
Author/Editor
高橋 龍史
元部 英次
花崎 正平 他
Alternative Title
Low thermal expansion materials for thin IC package substrates
Periodical title
パナソニック電工技報
No. or year of volume/issue
59(1) 2011.3
Volume
59
Issue
1