高耐熱・低熱膨張の多...

高耐熱・低熱膨張の多層基板材料 (特集 電子材料技術)

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高耐熱・低熱膨張の多層基板材料(特集 電子材料技術)

Call No. (NDL)
Z16-727
Bibliographic ID of National Diet Library
11059051
Material type
記事
Author
荒木 俊二ほか
Publisher
門真 : パナソニック電工R&D企画室
Publication date
2011-03
Material Format
Digital
Journal name
パナソニック電工技報 59(1) 2011.3
Publication Page
p.30~34
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Digital

Material Type
記事
Author/Editor
荒木 俊二
中村 善彦
Alternative Title
Multilayer circuit board material with high thermal resistance and low thermal expansion
Periodical title
パナソニック電工技報
No. or year of volume/issue
59(1) 2011.3
Volume
59
Issue
1