半導体デバイス用のヒート・シンクと熱電冷却モジュール,使いやすくなり放熱効果も上がる

Journal name: 日経エレクトロニクス = Nikkei electronics : sources of innovation (通号 416) 1987.03.09

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Material Type: 記事
Title: 半導体デバイス用のヒート・シンクと熱電冷却モジュール,使いやすくなり放熱効果も上がる
Author/Editor: Bill Travis
Author Heading: Bill Travis
Periodical title: 日経エレクトロニクス = Nikkei electronics : sources of innovation
No. or year of volume/issue: (通号 416) 1987.03.09
Sequential issue number: 416
Pages: p167～173
Publication date of volume/issue (W3CDTF): 1987-03-09
ISSN (Periodical Title): 0385-1680
ISSN-L (Periodical Title): 0385-1680
Publication (Periodical Title): 東京 : 日経BP
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Article Type: 記事分類: 電気工学--電子工学--電子部品
Holding library: 国立国会図書館
Call No.: Z16-751
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 3117625
http://id.ndl.go.jp/bib/3117625
Bibliographic Record Category (NDL): 632