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雑誌電子情報通信学会論文誌 C エレクトロニクス
Volume numberC C 71(11)(251)
Articleポリイミド膜の熱硬化...

ポリイミド膜の熱硬化過程におけるCuとの相互作用に関する検討

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ポリイミド膜の熱硬化過程におけるCuとの相互作用に関する検討

Call No. (NDL)
Z16-607
Bibliographic ID of National Diet Library
3206195
Material type
記事
Author
三浦 修 他
Publisher
東京 : 電子情報通信学会
Publication date
1988-11
Material Format
Digital
Journal name
電子情報通信学会論文誌. C, エレクトロニクス = The Transactions of the Institute of Electronics, Information and Communication Engineers / 電子情報通信学会 編 71(11) 1988.11
Publication Page
p.p1516～1521
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Digital

Material Type
記事
Title
ポリイミド膜の熱硬化過程におけるCuとの相互作用に関する検討
Author/Editor
三浦 修 他
Author Heading
三浦 修
Periodical title
電子情報通信学会論文誌. C, エレクトロニクス = The Transactions of the Institute of Electronics, Information and Communication Engineers / 電子情報通信学会 編
No. or year of volume/issue
71(11) 1988.11
Volume
71
Issue
11
Pages
p1516～1521
Publication date of volume/issue (W3CDTF)
1988-11