プリント配線板/銅張積層板の開発技術--ファインパターン化,多層化へと急進展 (′90年版プリント配線板のすべて--最新市場・技術動向/設計・実装事例 ; プリント配線板の最新技術動向)
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- Material Type
- 記事
- Author/Editor
- 青木 正光
- Author Heading
- Periodical title
- 電子技術
- No. or year of volume/issue
- 32(9) 1990.06
- Volume
- 32
- Issue
- 9
- Pages
- p13~41