Self-Aligned Passivation Technology for Copper Interconnection Using Copper-Aluminum Alloy (Solid State Devices and Materials)

Icons representing 記事

Self-Aligned Passivation Technology for Copper Interconnection Using Copper-Aluminum Alloy(Solid State Devices and Materials)

Call No. (NDL)
Z53-A375
Bibliographic ID of National Diet Library
4196664
Material type
記事
Author
Nobuyoshi Awayaほか
Publisher
Tokyo : Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physics
Publication date
1997-03
Material Format
Digital
Journal name
Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP 36(3B) 1997.03
Publication Page
p.1548~1553
View All

Detailed bibliographic record

Summary, etc.:

A self-aligned passivation procedure for fabricating copper interconnection has been developed using Al-Cu alloy formation. With annealing at 350<SUP>...

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

  • CiNii Research

    Search Service
    Digital
    You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Digital

Material Type
記事
Author/Editor
Nobuyoshi Awaya
Toshio Kobayashi
Periodical title
Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP
No. or year of volume/issue
36(3B) 1997.03
Volume
36
Issue
3B
Pages
1548~1553