半導体パッケージ用プリント基板 (特集材料・分析技術の応用と展開)

半導体パッケージ用プリント基板

(特集材料・分析技術の応用と展開)

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Material Type: 記事
Title: 半導体パッケージ用プリント基板
Author/Editor: 岡誠次
古橋靖夫
沢田祐子他
Series Title: 特集材料・分析技術の応用と展開
Author Heading: 岡誠次
古橋靖夫
沢田祐子
Periodical title: 三菱電機技報
No. or year of volume/issue: 73(2) (通号 813) 1999.02
Volume: 73
Issue: 2
Sequential issue number: 813
Pages: 120～123
Publication date of volume/issue (W3CDTF): 1999-02
ISSN (Periodical Title): 0369-2302
ISSN-L (Periodical Title): 0369-2302
Publication (Periodical Title): 東京 : 三菱電機エンジニアリングe-ソリューション&サービス事業部 ; 1962-2023
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN31
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-263
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 4669294
http://id.ndl.go.jp/bib/4669294
Bibliographic Record Category (NDL): 632