雑誌電子情報通信学会技術研究報告 : 信学技報
Volume number99(421)-99(431) 19991100-19991100
Article半導体膜/圧電体基板...

半導体膜/圧電体基板構造を用いたSAWデバイスの開発

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半導体膜/圧電体基板構造を用いたSAWデバイスの開発

Call No. (NDL)
Z16-940
Bibliographic ID of National Diet Library
4933473
Material type
記事
Author
後藤 広将ほか
Publisher
東京 : 電子情報通信学会
Publication date
1999-11-11
Material Format
Paper
Journal name
電子情報通信学会技術研究報告 = IEICE technical report : 信学技報 99 (通号 422) 1999.11.11
Publication Page
p.15～22
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Paper

Material Type
記事
Title
半導体膜/圧電体基板構造を用いたSAWデバイスの開発
Author/Editor
後藤 広将
綱嶋 正通
菅野 康人 他
Author Heading
後藤 広将
綱嶋 正通
菅野 康人
Periodical title
電子情報通信学会技術研究報告 = IEICE technical report : 信学技報
No. or year of volume/issue
99 (通号 422) 1999.11.11
Volume
99
Sequential issue number
422
Pages
15～22
Publication date of volume/issue (W3CDTF)
1999-11-11