Early Increase in Resistance during Electlomigration in AlCu-plugged Via Structures

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Early Increase in Resistance during Electlomigration in AlCu-plugged Via Structures

Call No. (NDL)
Z53-A375
Bibliographic ID of National Diet Library
5319964
Material type
記事
Author
Kazuhiro Hoshino
Publisher
Tokyo : Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physics
Publication date
2000-03
Material Format
Digital
Journal name
Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP 39(3A) (通号 515) 2000.03
Publication Page
p.994~998
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Detailed bibliographic record

Summary, etc.:

This paper reports on the electromigration (EM) failure mechanism in AlCu-plugged via holes. Based on an observed increase in the via chain resistance...

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Bibliographic Record

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Digital

Material Type
記事
Author/Editor
Kazuhiro Hoshino
Author Heading
Periodical title
Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP
No. or year of volume/issue
39(3A) (通号 515) 2000.03
Volume
39
Issue
3A
Sequential issue number
515
Pages
994~998