Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip

Available with Digitized Contents Transmission Service

NDL Digital Collections

Available for viewing via the Digitized Contents Transmission Service for Individuals to official registered users of the NDL, who resides in Japan.

Become an official registered user >

Digital data available（Japan Link Center）

Begin reading now

CiNii Research

Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip

Call No. (NDL): Z53-A375
Bibliographic ID of National Diet Library: 5386699

Material type: 記事

Author: Kang Wook Leeほか

Publisher: Tokyo : Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physics

Publication date: 2000-04

Material Format: Digital

Journal name: Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP 39(4B) (通号 518) 2000.04

Publication Page: p.2473～2477

View All

Detailed bibliographic record

Summary, etc.：: A new three-dimensional (3D) integration technology for realizing a highly parallel image-processing chip has been developed. Several LSI wafers are v...

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

List of Cooperating Institutions and Databases

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

CiNii Research
Search Service
Digital
You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Check the holdings of this book

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Digital

Material Type: 記事
Title: Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip
Author/Editor: Kang Wook Lee
Tomonori Nakamura
Katsuyuki Sakuma 他
Author Heading: Kang Wook Lee
Tomonori Nakamura
Katsuyuki Sakuma
Periodical title: Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP
No. or year of volume/issue: 39(4B) (通号 518) 2000.04
Volume: 39
Issue: 4B
Sequential issue number: 518
Pages: 2473～2477
Publication date of volume/issue (W3CDTF): 2000-04
ISSN (Periodical Title): 0021-4922
ISSN-L (Periodical Title): 0021-4922
Publication (Periodical Title): Tokyo : Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physics
Place of Publication (Country Code): JP
Text Language Code: eng
Subject Heading: three dimensional integration LSI
3D
image sensor
wafer-level bonding
NDLC: ZM35
Target Audience: 一般
Collection (particular): 国立国会図書館デジタルコレクション > デジタル化資料 > 雑誌
https://dl.ndl.go.jp/collections/A00002
Access Restrictions: 国立国会図書館内限定公開
Service for the Digitized Contents Transmission Service: 図書館・個人送信対象
Availability of remote photoduplication service: 可
Holding library: 国立国会図書館
Call No.: Z53-A375
Periodical Title (Persistent ID (NDL)): info:ndljp/pid/11226593
https://dl.ndl.go.jp/pid/11226593
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 5386699
http://id.ndl.go.jp/bib/5386699
Bibliographic Record Category (NDL): 632