シリコンウェーハの数値制御ドライ平坦化加工 (特集 シリコンウェーハの加工メカニズム)

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シリコンウェーハの数値制御ドライ平坦化加工

(特集 シリコンウェーハの加工メカニズム)

Call No. (NDL)
Z16-1147
Bibliographic ID of National Diet Library
5495673
Material type
記事
Author
柳澤 道彦
Publisher
東京 : 砥粒加工学会
Publication date
2000-10
Material Format
Paper
Journal name
Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology 44(10) (通号 218) 2000.10
Publication Page
p.437~440
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Paper

Material Type
記事
Author/Editor
柳澤 道彦
Author Heading
Periodical title
Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology
No. or year of volume/issue
44(10) (通号 218) 2000.10
Volume
44
Issue
10
Sequential issue number
218