Next平坦化テクノロジー採用のCMP装置「Momentum」 (特集新材料・新プロセスによる半導体薄膜形成技術--銅配線,Low-k,High-k,CMPの最新動向を探る)

Next平坦化テクノロジー採用のCMP装置「Momentum」

(特集新材料・新プロセスによる半導体薄膜形成技術--銅配線,Low-k,High-k,CMPの最新動向を探る)

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Material Type: 記事
Title: Next平坦化テクノロジー採用のCMP装置「Momentum」
Author/Editor: 渡邉直樹
Series Title: 特集新材料・新プロセスによる半導体薄膜形成技術--銅配線,Low-k,High-k,CMPの最新動向を探る
Author Heading: 渡邉直樹
Periodical title: 電子材料
No. or year of volume/issue: 40(5) 2001.5
Volume: 40
Issue: 5
Pages: 38～42
Publication date of volume/issue (W3CDTF): 2001-05
ISSN (Periodical Title): 0387-0774
ISSN-L (Periodical Title): 0387-0774
Publication (Periodical Title): 東京 : 工業調査会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-225
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 5752429
http://id.ndl.go.jp/bib/5752429
Bibliographic Record Category (NDL): 632