解説無電解ニッケル/金めっきのはんだボール接合強度(小特集マイクロデバイス実装と表面技術(1))

Journal name: 表面技術 = Journal of the Surface Finishing Society of Japan 52(5) 2001

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Material Type: 記事
Title: 解説無電解ニッケル/金めっきのはんだボール接合強度
Author/Editor: 渡辺泰裕
Series Title: 小特集マイクロデバイス実装と表面技術(1)
Author Heading: 渡辺泰裕
Periodical title: 表面技術 = Journal of the Surface Finishing Society of Japan
No. or year of volume/issue: 52(5) 2001
Volume: 52
Issue: 5
Pages: 379～381
Publication date of volume/issue (W3CDTF): 2001
ISSN (Periodical Title): 0915-1869
ISSN-L (Periodical Title): 0915-1869
Publication (Periodical Title): 東京 : 表面技術協会
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: E.L.Ni/Au
Solder Joint Strength
NDLC: ZP41
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z17-291
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 5764573
http://id.ndl.go.jp/bib/5764573
Bibliographic Record Category (NDL): 632