平坦化CMPによるCu表面の常温接合と次世代実装技術 (特集1 半導体平坦化CMP技術と他分野応用におけるトライボロジー)

平坦化CMPによるCu表面の常温接合と次世代実装技術

(特集1 半導体平坦化CMP技術と他分野応用におけるトライボロジー)

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Material Type: 記事
Title: 平坦化CMPによるCu表面の常温接合と次世代実装技術
Author/Editor: 伊藤寿浩
須賀唯知
Series Title: 特集1 半導体平坦化CMP技術と他分野応用におけるトライボロジー
Author Heading: 伊藤寿浩
須賀唯知
Periodical title: 月刊トライボロジー
No. or year of volume/issue: 15(7) (通号 167) 2001.7
Volume: 15
Issue: 7
Sequential issue number: 167
Pages: 24～26
Publication date of volume/issue (W3CDTF): 2001-07
ISSN (Periodical Title): 0914-6121
ISSN-L (Periodical Title): 0914-6121
Publication (Periodical Title): 東京 : 新樹社
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN11
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1638
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 5837696
http://id.ndl.go.jp/bib/5837696
Bibliographic Record Category (NDL): 632