樹脂埋め込み型高周波MCMへのSTO薄膜容量内蔵プロセス技術の検討および周波数特性
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- Material Type
- 記事
- Author/Editor
- 山田 宏治山下 喜市
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 4(7) (通号 27) 2001.11
- Volume
- 4
- Issue
- 7
- Sequential issue number
- 27
- Pages
- 590～596