電析法により作製したCu/Ni-P多層膜の構造と硬度に及ぼす熱処理の影響

Journal name: 表面技術 = Journal of the Surface Finishing Society of Japan 52(11) 2001

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

CiNii Research
Search Service
Digital
You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Check the holdings of this book

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 記事
Title: 電析法により作製したCu/Ni-P多層膜の構造と硬度に及ぼす熱処理の影響
Author/Editor: 三宅猛司
久米道之
箕浦秀樹
Author Heading: 三宅猛司
久米道之
箕浦秀樹
Periodical title: 表面技術 = Journal of the Surface Finishing Society of Japan
No. or year of volume/issue: 52(11) 2001
Volume: 52
Issue: 11
Pages: 757～761
Publication date of volume/issue (W3CDTF): 2001
ISSN (Periodical Title): 0915-1869
ISSN-L (Periodical Title): 0915-1869
Publication (Periodical Title): 東京 : 表面技術協会
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: Electrodeposition
Cu/Ni-P Multilayer
Annealing
Hardness
NDLC: ZP41
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z17-291
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 5975079
http://id.ndl.go.jp/bib/5975079
Bibliographic Record Category (NDL): 632