AFRP多層プリント基板の回路接続用小径穴の加工特性--ケブラー繊維およびテクノーラ繊維強化基板の比較

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Material Type: 記事
Title: AFRP多層プリント基板の回路接続用小径穴の加工特性--ケブラー繊維およびテクノーラ繊維強化基板の比較
Author/Editor: 廣垣俊樹
中川平三郎
中村隆英他
Author Heading: 廣垣俊樹
中川平三郎
中村隆英
Periodical title: 日本機械学会論文集. A編
No. or year of volume/issue: 68(666) 2002.2
Volume: 68
Issue: 666
Pages: 258～265
Publication date of volume/issue (W3CDTF): 2002-02
ISSN (Periodical Title): 0387-5008
ISSN-L (Periodical Title): 0387-5008
Publication (Periodical Title): 東京 : 日本機械学会 ; 1979-2010
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: Printed Wiring Boards
Drilling
Laser
Copper Plating
Blind via Hole
Throuth Hole
NDLC: ZM16
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z14-737
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 6083195
http://id.ndl.go.jp/bib/6083195
Bibliographic Record Category (NDL): 632