全冊特集光回路実装技術の現状と今後--ブロードバンド時代を迎えて

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 5(5) (通号 32) 2002.8

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Material Type: 記事
Title: 全冊特集光回路実装技術の現状と今後--ブロードバンド時代を迎えて
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 5(5) (通号 32) 2002.8
Volume: 5
Issue: 5
Sequential issue number: 32
Pages: 433～514
Publication date of volume/issue (W3CDTF): 2002-08
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 6250196
http://id.ndl.go.jp/bib/6250196
Bibliographic Record Category (NDL): 632