Sn-3.0Ag-0.5Cuはんだ接合部における相成長による熱疲労き裂発生評価

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Material Type: 記事
Title: Sn-3.0Ag-0.5Cuはんだ接合部における相成長による熱疲労き裂発生評価
Author/Editor: 佐山利彦
山崎聡子
長井喜昭他
Author Heading: 佐山利彦
山崎聡子
長井喜昭
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 12 2002.10.8・9
Volume: 12
Pages: 119～122
Publication date of volume/issue (W3CDTF): 2002-10
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 6344814
http://id.ndl.go.jp/bib/6344814
Bibliographic Record Category (NDL): 632