半導体パッケージの界面接着不良(特集 IT産業を支える新しい粘着・接着技術)

Journal name: 日本接着学会誌 = Journal of the Adhesion Society of Japan : adhesion 38(12) 2002

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Material Type: 記事
Title: 半導体パッケージの界面接着不良
Author/Editor: 雨海正純
Series Title: 特集 IT産業を支える新しい粘着・接着技術
Author Heading: 雨海正純
Periodical title: 日本接着学会誌 = Journal of the Adhesion Society of Japan : adhesion
No. or year of volume/issue: 38(12) 2002
Volume: 38
Issue: 12
Pages: 477～484
Publication date of volume/issue (W3CDTF): 2002
ISSN (Periodical Title): 0916-4812
ISSN-L (Periodical Title): 0916-4812
Publication (Periodical Title): 大阪 : 日本接着学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZP16
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z17-134
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 6376943
http://id.ndl.go.jp/bib/6376943
Bibliographic Record Category (NDL): 632