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雑誌エレクトロニクス実装学会誌
Volume number6(1) (通号 35)-6(7) (通号 41) 20030100-20031100
Article無電解Ni-P/Au...

無電解Ni-P/AuめっきとSn-Ag系鉛フリーはんだの界面反応と接合部強度

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無電解Ni-P/AuめっきとSn-Ag系鉛フリーはんだの界面反応と接合部強度

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
6690509
Material type
記事
Author
平森 智幸ほか
Publisher
東京 : エレクトロニクス実装学会
Publication date
2003-09
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 6(6) (通号 40) 2003.9
Publication Page
p.503～508
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Paper

Material Type
記事
Title
無電解Ni-P/AuめっきとSn-Ag系鉛フリーはんだの界面反応と接合部強度
Author/Editor
平森 智幸
廣瀬 明夫
小林 紘二郎 他
Author Heading
平森 智幸
廣瀬 明夫
小林 紘二郎
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
6(6) (通号 40) 2003.9
Volume
6
Issue
6
Sequential issue number
40
Pages
503～508