Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint

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Material Type: 記事
Title: Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint
Author/Editor: Jae-Hoon Choi
Kwang-Yong Lee
Sung-Woo Jun 他
Author Heading: Jae-Hoon Choi
Kwang-Yong Lee
Sung-Woo Jun
Periodical title: Materials transactions
No. or year of volume/issue: 46(5) 2005.5
Volume: 46
Issue: 5
Pages: 1042～1046
Publication date of volume/issue (W3CDTF): 2005-05
ISSN (Periodical Title): 1345-9678
ISSN-L (Periodical Title): 1345-9678
Publication (Periodical Title): Sendai : The Japan Institute of Metals and Materials ; 2001-
Place of Publication (Country Code): JP
Text Language Code: eng
Subject Heading: 48tin-52indium solder
chip on glass
flip chip
NDLC: ZP41
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z53-J286
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 7316444
http://id.ndl.go.jp/bib/7316444
Bibliographic Record Category (NDL): 632