エンベッディドパッシブ技術(特集/電子部品・実装技術の将来課題)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 8(3) (通号 51) 2005.5

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Material Type: 記事
Title: エンベッディドパッシブ技術
Author/Editor: 今中佳彦
Series Title: 特集/電子部品・実装技術の将来課題
Author Heading: 今中佳彦
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 8(3) (通号 51) 2005.5
Volume: 8
Issue: 3
Sequential issue number: 51
Pages: 170～177
Publication date of volume/issue (W3CDTF): 2005-05
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 7350560
http://id.ndl.go.jp/bib/7350560
Bibliographic Record Category (NDL): 632