Chip-interleaved DS-CDMA with 2-dimensinal OVSF spreading code (移動通信ワークショップ)

Chip-interleaved DS-CDMA with 2-dimensinal OVSF spreading code

(移動通信ワークショップ)

Journal name: 電子情報通信学会技術研究報告 = IEICE technical report : 信学技報 104(685) 2005.3.3

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Material Type: 記事
Title: Chip-interleaved DS-CDMA with 2-dimensinal OVSF spreading code
Author/Editor: 劉楽
安達文幸
Series Title: 移動通信ワークショップ
Author Heading: 劉楽
安達文幸
Alternative Title: 2次元OVSF拡散符号を用いるチップインターリーブDS-CDMA
Periodical title: 電子情報通信学会技術研究報告 = IEICE technical report : 信学技報
No. or year of volume/issue: 104(685) 2005.3.3
Volume: 104
Issue: 685
Pages: 33～38
Publication date of volume/issue (W3CDTF): 2005-03-03
ISSN (Periodical Title): 0913-5685
ISSN-L (Periodical Title): 0913-5685
Publication (Periodical Title): 東京 : 電子情報通信学会
Place of Publication (Country Code): JP
Text Language Code: eng
Subject Heading: multi-rate
uplink transmission
interleaving
OVSF
NDLC: ZN33
Target Audience: 一般
Report No. (Article): MW2004-282
Holding library: 国立国会図書館
Call No.: Z16-940
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 7353695
http://id.ndl.go.jp/bib/7353695
Bibliographic Record Category (NDL): 632