半導体技術を用いた薄膜キャパシタ受動部品の作製
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CiNii Research
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- Material Type
- 記事
- Author/Editor
- 小岩 一郎足利 欣哉照井 誠 他
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 8(6) (通号 54) 2005.9
- Volume
- 8
- Issue
- 6
- Sequential issue number
- 54
- Pages
- 517～522