アンダーフィル粘弾性解析によるフリップチップ接続バンプの熱疲労寿命予測

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Material Type: 記事
Title: アンダーフィル粘弾性解析によるフリップチップ接続バンプの熱疲労寿命予測
Author/Editor: 近藤卓
平田一郎
Author Heading: 近藤卓
平田一郎
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 15 2005.10.13・14
Volume: 15
Pages: 29～32
Publication date of volume/issue (W3CDTF): 2005-10
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 7886010
http://id.ndl.go.jp/bib/7886010
Bibliographic Record Category (NDL): 632