高速・高密度実装回路設計に向けた近傍電磁界計測技術 (特集/電磁特性と計測技術)

高速・高密度実装回路設計に向けた近傍電磁界計測技術

(特集/電磁特性と計測技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 10(3) (通号 65) 2007.5

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Material Type: 記事
Title: 高速・高密度実装回路設計に向けた近傍電磁界計測技術
Author/Editor: 岩波瑞樹
Series Title: 特集/電磁特性と計測技術
Author Heading: 岩波瑞樹
Alternative Title: Electromagnetic near-field measurement technique toward high speed, densely circuits designs
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 10(3) (通号 65) 2007.5
Volume: 10
Issue: 3
Sequential issue number: 65
Pages: 185～189
Publication date of volume/issue (W3CDTF): 2007-05
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 8814604
http://id.ndl.go.jp/bib/8814604
Bibliographic Record Category (NDL): 632