ポリエチレングリコール誘導体の予備吸着を利用する銅電析プロセスによるULSI微細配線の形成
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- Material Type
- 記事
- Author/Editor
- 尾山 祐斗有村 英俊赤松 謙祐 他
- Alternative Title
- Formation of ULSI interconnection by copper electrodeposition process using the pre-adsorption of polyethylene glycol derivative
- Periodical title
- 表面技術 = Journal of the Surface Finishing Society of Japan
- No. or year of volume/issue
- 58(7) 2007.7
- Volume
- 58
- Issue
- 7
- Pages
- 425～429