電子部品実装済プリント回路板の環境負荷評価 (特集環境調和型実装へ向けた革新技術)

電子部品実装済プリント回路板の環境負荷評価

(特集環境調和型実装へ向けた革新技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 10(4) (通号 66) 2007.7

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Material Type: 記事
Title: 電子部品実装済プリント回路板の環境負荷評価
Author/Editor: 堀越裕三
端谷隆文
Series Title: 特集環境調和型実装へ向けた革新技術
Author Heading: 堀越裕三
端谷隆文
Alternative Title: Environmental burden of printed circuit board on which electronic parts are mounted
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 10(4) (通号 66) 2007.7
Volume: 10
Issue: 4
Sequential issue number: 66
Pages: 281～285
Publication date of volume/issue (W3CDTF): 2007-07
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 8881462
http://id.ndl.go.jp/bib/8881462
Bibliographic Record Category (NDL): 632