電解Ni/Auめっきを用いたBGA鉛フリーはんだ接合部の衝撃信頼性におよぼすNiめっき条件の影響

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電解Ni/Auめっきを用いたBGA鉛フリーはんだ接合部の衝撃信頼性におよぼすNiめっき条件の影響

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
8881521
Material type
記事
Author
山本 健一ほか
Publisher
東京 : エレクトロニクス実装学会
Publication date
2007-07
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 10(4) (通号 66) 2007.7
Publication Page
p.305~313
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Paper

Material Type
記事
Author/Editor
山本 健一
赤星 晴夫
加藤 隆彦 他
Alternative Title
Effect of Ni plating condition on lead-free solder joints reliability of BGA using electroplated Ni/Au under impact load
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
10(4) (通号 66) 2007.7
Volume
10
Issue
4
Sequential issue number
66