多層配線デバイス製造を支える最新のCMP平坦化技術 (特集 半導体デバイスの平坦化技術)
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- Material Type
- 記事
- Author/Editor
- 辻村 学
- Series Title
- Author Heading
- Alternative Title
- CMP technology for interconnect of semiconductor device
- Periodical title
- 精密工学会誌 = Journal of the Japan Society for Precision Engineering / 会誌編集委員会 編
- No. or year of volume/issue
- 73(7) (通号 871) 2007.7
- Volume
- 73
- Issue
- 7