半導体デバイスの裏面研削技術 (特集 半導体デバイスの平坦化技術)
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- Material Type
- 記事
- Title
- Author/Editor
- 石川 一政小林 一雄
- Series Title
- Alternative Title
- The back grinding technology for semiconductor device
- Periodical title
- 精密工学会誌 = Journal of the Japan Society for Precision Engineering / 会誌編集委員会 編
- No. or year of volume/issue
- 73(7) (通号 871) 2007.7
- Volume
- 73
- Issue
- 7