LiTaO3/サファイア接合基板を用いた温度特性改善SAWデバイス (特集:新しい材料やプロセスを利用した機能弾性波素子)
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- Material Type
- 記事
- Author/Editor
- 三浦 道雄井上 将吾堤 潤 他
- Series Title
- Alternative Title
- Temperature compensated SAW devices using bonded LiTaO3/sapphire
- Periodical title
- 電気学会論文誌. C, 電子・情報・システム部門誌 = IEEJ transactions on electronics, information and systems
- No. or year of volume/issue
- 127(8) 2007.8
- Volume
- 127
- Issue
- 8