無電解銅めっきによる微細ホールのボトムアップ堆積 (小特集 最近の話題を追って(2))
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CiNii Research
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- Material Type
- 記事
- Author/Editor
- 新宮原 正三王 増林
- Series Title
- Alternative Title
- Bottom-up fill of Cu in ultra-fine holes by electroless plating
- Periodical title
- 表面技術 = Journal of the Surface Finishing Society of Japan
- No. or year of volume/issue
- 58(8) 2007.8
- Volume
- 58
- Issue
- 8