高容量フラッシュメモリーパッケージング技術 (特集 半導体パッケージ技術の最新動向 ; パッケージ技術における複合化技術の最新動向)

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高容量フラッシュメモリーパッケージング技術(特集 半導体パッケージ技術の最新動向 ; パッケージ技術における複合化技術の最新動向)

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
8914044
Material type
記事
Author
明島 周三
Publisher
東京 : エレクトロニクス実装学会
Publication date
2007-08
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 10(5) (通号 67) 2007.8
Publication Page
p.375~379
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Paper Digital

Material Type
記事
Author/Editor
明島 周三
Author Heading
Alternative Title
High density flash memory packaging technology
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
10(5) (通号 67) 2007.8
Volume
10
Issue
5