薄膜受動部品を内蔵したSi貫通孔電極付パッケージ基板の開発 (特集半導体パッケージ技術の最新動向 ; パッケージ基板技術の最新動向)

薄膜受動部品を内蔵したSi貫通孔電極付パッケージ基板の開発

(特集半導体パッケージ技術の最新動向 ; パッケージ基板技術の最新動向)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 10(5) (通号 67) 2007.8

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

CiNii Research
Search Service
You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Check the holdings of this book

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 記事
Title: 薄膜受動部品を内蔵したSi貫通孔電極付パッケージ基板の開発
Author/Editor: 倉持悟
福岡義孝
Series Title: 特集半導体パッケージ技術の最新動向 ; パッケージ基板技術の最新動向
Author Heading: 倉持悟
福岡義孝
Alternative Title: Development of embedded passive substrate with silicon through interconnection
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 10(5) (通号 67) 2007.8
Volume: 10
Issue: 5
Sequential issue number: 67
Pages: 399～402
Publication date of volume/issue (W3CDTF): 2007-08
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 8914254
http://id.ndl.go.jp/bib/8914254
Bibliographic Record Category (NDL): 632