3次元集積化とCu直接接合 (特集半導体パッケージ技術の最新動向 ; パッケージ組み立てにおける最新加工技術)

3次元集積化とCu直接接合

(特集半導体パッケージ技術の最新動向 ; パッケージ組み立てにおける最新加工技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 10(5) (通号 67) 2007.8

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Material Type: 記事
Title: 3次元集積化とCu直接接合
Author/Editor: 須賀唯知
Series Title: 特集半導体パッケージ技術の最新動向 ; パッケージ組み立てにおける最新加工技術
Author Heading: 須賀唯知
Alternative Title: 3D integration and CU direct bonding
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 10(5) (通号 67) 2007.8
Volume: 10
Issue: 5
Sequential issue number: 67
Pages: 408～414
Publication date of volume/issue (W3CDTF): 2007-08
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 8914282
http://id.ndl.go.jp/bib/8914282
Bibliographic Record Category (NDL): 632