雑誌粉体および粉末冶金 : 粉体粉末冶金協会誌
Volume number54(7)-54(12):2007.7-2007.12 (付録・総目次54(1)-54(12)共)
Articleパルス通電圧接法(P...

パルス通電圧接法(PCHP)による金属/金属間化合物積層材料の高機能化 (特集 電磁プロセスの新展開)

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パルス通電圧接法(PCHP)による金属/金属間化合物積層材料の高機能化(特集 電磁プロセスの新展開)

Call No. (NDL)
Z17-274
Bibliographic ID of National Diet Library
8932104
Material type
記事
Author
水内 潔ほか
Publisher
京都 : 粉体粉末冶金協会
Publication date
2007-08
Material Format
Paper
Journal name
粉体および粉末冶金 = Journal of the Japan Society of Powder and Powder Metallurgy : 粉体粉末冶金協会誌 / 粉体粉末冶金協会 編 54(8) 2007.8
Publication Page
p.560～569
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Material Type
記事
Title
パルス通電圧接法(PCHP)による金属/金属間化合物積層材料の高機能化
Author/Editor
水内 潔
井上 漢龍
川原 正和 他
Series Title
特集 電磁プロセスの新展開
Author Heading
水内 潔
井上 漢龍
川原 正和
Alternative Title
Functionalizing of metal/intermetallic laminate materials by pulsed current hot pressing (PCHP)
Periodical title
粉体および粉末冶金 = Journal of the Japan Society of Powder and Powder Metallurgy : 粉体粉末冶金協会誌 / 粉体粉末冶金協会 編
No. or year of volume/issue
54(8) 2007.8
Volume
54
Issue
8