MEMSパッケージ封止接合部の強度信頼性評価 (特集 マイクロマテリアル)
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- Material Type
- 記事
- Author/Editor
- 片桐 大輔横山 吉典坂本 博夫 他
- Series Title
- Alternative Title
- Bonding strength evaluation for hermetic seal of MEMS package
- Periodical title
- 材料 / 日本材料学会 [編]
- No. or year of volume/issue
- 56(10) 2007.10
- Volume
- 56
- Issue
- 10