多様化する基板実装へのソリューション--新技術に対応可能な進化型実装プラットフォーム(特集実装関連設備の最先端)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 10(7) (通号 69) 2007.11

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Material Type: 記事
Title: 多様化する基板実装へのソリューション--新技術に対応可能な進化型実装プラットフォーム
Author/Editor: 服部友彦
Series Title: 特集実装関連設備の最先端
Author Heading: 服部友彦
Alternative Title: Solution to diversified PCB assembly: the evolution type Jisso platform that can support a new technology
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 10(7) (通号 69) 2007.11
Volume: 10
Issue: 7
Sequential issue number: 69
Pages: 510～513
Publication date of volume/issue (W3CDTF): 2007-11
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 9262833
http://id.ndl.go.jp/bib/9262833
Bibliographic Record Category (NDL): 632