Void-free room-temperature silicon wafer direct bonding using sequential plasma activation (Special issue: Solid state devices and materials)
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- Material Type
- 記事
- Author/Editor
- Chenxi WangEiji HigurashiTadatomo Suga
- Series Title
- Author Heading
- Periodical title
- Japanese journal of applied physics : JJAP
- No. or year of volume/issue
- 47(4) (2) 2008.4
- Volume
- 47
- Issue
- 4
- Other Volume
- 2