CMP/Low-kインテグレーション技術の最新動向 (特集半導体プロセス技術最前線--CMP・多層配線技術/Si貫通電極プロセス)

CMP/Low-kインテグレーション技術の最新動向

(特集半導体プロセス技術最前線--CMP・多層配線技術/Si貫通電極プロセス)

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Material Type: 記事
Title: CMP/Low-kインテグレーション技術の最新動向
Author/Editor: 辻村学
Series Title: 特集半導体プロセス技術最前線--CMP・多層配線技術/Si貫通電極プロセス
Author Heading: 辻村学
Periodical title: 電子材料
No. or year of volume/issue: 47(5) 2008.5
Volume: 47
Issue: 5
Pages: 18～23
Publication date of volume/issue (W3CDTF): 2008-05
ISSN (Periodical Title): 0387-0774
ISSN-L (Periodical Title): 0387-0774
Publication (Periodical Title): 東京 : 工業調査会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-225
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 9495344
http://id.ndl.go.jp/bib/9495344
Bibliographic Record Category (NDL): 632