常圧溶解法によるプリント配線板リサイクル技術 (特集実装をとりまく環境技術)

常圧溶解法によるプリント配線板リサイクル技術

(特集実装をとりまく環境技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 11(6) (通号 75) 2008.9

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Material Type: 記事
Title: 常圧溶解法によるプリント配線板リサイクル技術
Author/Editor: 柴田勝司
Series Title: 特集実装をとりまく環境技術
Author Heading: 柴田勝司
Alternative Title: Printed wiring boards recycling technology using depolymerization under ordinary pressure
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 11(6) (通号 75) 2008.9
Volume: 11
Issue: 6
Sequential issue number: 75
Pages: 408～412
Publication date of volume/issue (W3CDTF): 2008-09
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 9642960
http://id.ndl.go.jp/bib/9642960
Bibliographic Record Category (NDL): 632