Microelectronic wire bonding with insulated Au wire: effects of process parameters on insulation removal and crescent bonding
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- Material Type
- 記事
- Author/Editor
- Jaesik LeeMichael MayerNorman Zhou 他
- Author Heading
- Periodical title
- Materials transactions
- No. or year of volume/issue
- 49(10) 2008.10
- Volume
- 49
- Issue
- 10
- Pages
- 2347～2353
- Publication date of volume/issue (W3CDTF)
- 2008-10